What are the principles and difficulties of ceramic substrate casting technology
DATE：2023/7/25 14:38:20 / READ： / SOURCE：This station
Ceramic substrate casting technology is an advanced process for preparing ceramic thin films. It suspends the ceramic powder in the solvent, uses the principle of Fluid mechanics and surface tension control technology to make the ceramic powder evenly dispersed in the solvent, and then through continuous tape casting, drying and sintering processes, finally obtains a ceramic substrate with a certain thickness and flatness.
The working principle of ceramic substrate tape casting technology is based on Fluid mechanics and the control principle of surface tension. Firstly, mix the ceramic powder with the solvent to form a suspension. By adjusting the viscosity and surface tension of the suspension, it has flowability suitable for casting. Then, the suspension is injected into the feeding groove of the casting machine, and by controlling the speed and pressure of the casting machine, the suspension flows evenly in the casting area of the casting machine. During the casting process, the thickness and flatness of the ceramic substrate are controlled by adjusting the spacing between the casting roller and the support roller of the casting machine. Next, the ceramic substrate obtained by casting undergoes drying and sintering processes to remove solvents and combine ceramic particles, ultimately obtaining a ceramic substrate with a certain thickness and flatness.
The technical difficulties of ceramic substrate casting technology mainly include the following aspects:
Stability of suspension: The dispersion and stability of ceramic powder in solvents are crucial for the casting process. Ceramic powders are prone to agglomeration, which affects the fluidity and uniformity of the suspension. Therefore, it is necessary to carry out appropriate surface modification and the addition of dispersants to the suspension to improve its stability.
Control of the casting process: The control of parameters such as speed, pressure, and roller spacing of the casting machine has a significant impact on the thickness and flatness of the ceramic substrate. It is necessary to optimize the selection and adjustment of parameters to ensure the stability and uniformity of the casting process and ensure the quality of the ceramic substrate.
Drying and sintering process: The drying and sintering process of ceramic substrates plays an important role in removing solvents, improving the bonding strength of ceramic particles, and controlling the size of the substrate. It is necessary to choose appropriate drying and sintering conditions to avoid problems such as deformation and cracking of the substrate.
The performance and application requirements of ceramic substrates are also one of the technical difficulties. Different ceramic materials have different performance and application requirements, and optimization design and process control need to be carried out based on specific materials and application scenarios.
Ceramic substrate casting technology, as an advanced preparation process, has the advantages of preparing large area, high-quality, and thin thickness ceramic substrates. It has broad application prospects in fields such as microelectronics, optoelectronics, energy, sensors, etc. With the continuous development of material science and process technology, ceramic substrate casting technology will be further improved and applied.
The working principle of ceramic substrate tape casting technology is based on Fluid mechanics and the control principle of surface tension. Firstly, mix the ceramic powder with the solvent to form a suspension. By adjusting the viscosity and surface tension of the suspension, it has flowability suitable for casting. Then, the suspension is injected into the feeding groove of the casting machine, and by controlling the speed and pressure of the casting machine, the suspension flows evenly in the casting area of the casting machine. During the casting process, the thickness and flatness of the ceramic substrate are controlled by adjusting the spacing between the casting roller and the support roller of the casting machine. Next, the ceramic substrate obtained by casting undergoes drying and sintering processes to remove solvents and combine ceramic particles, ultimately obtaining a ceramic substrate with a certain thickness and flatness.
The technical difficulties of ceramic substrate casting technology mainly include the following aspects:
Stability of suspension: The dispersion and stability of ceramic powder in solvents are crucial for the casting process. Ceramic powders are prone to agglomeration, which affects the fluidity and uniformity of the suspension. Therefore, it is necessary to carry out appropriate surface modification and the addition of dispersants to the suspension to improve its stability.
Control of the casting process: The control of parameters such as speed, pressure, and roller spacing of the casting machine has a significant impact on the thickness and flatness of the ceramic substrate. It is necessary to optimize the selection and adjustment of parameters to ensure the stability and uniformity of the casting process and ensure the quality of the ceramic substrate.
Drying and sintering process: The drying and sintering process of ceramic substrates plays an important role in removing solvents, improving the bonding strength of ceramic particles, and controlling the size of the substrate. It is necessary to choose appropriate drying and sintering conditions to avoid problems such as deformation and cracking of the substrate.
The performance and application requirements of ceramic substrates are also one of the technical difficulties. Different ceramic materials have different performance and application requirements, and optimization design and process control need to be carried out based on specific materials and application scenarios.
Ceramic substrate casting technology, as an advanced preparation process, has the advantages of preparing large area, high-quality, and thin thickness ceramic substrates. It has broad application prospects in fields such as microelectronics, optoelectronics, energy, sensors, etc. With the continuous development of material science and process technology, ceramic substrate casting technology will be further improved and applied.
Author：admin